Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability-Reference-Cited by-同舟云学术

Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability

Published:2024-09 Issue:9 Volume:39 Page:10638-10650
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Chen Chuantong¹^ORCID,Suetake Aiji¹,Huo Fupeng¹,Kim Dongjin²,Zhang Zheng¹^ORCID,Hsieh Ming-Chun¹,Li Wanli³^ORCID,Wakasugi Naoki⁴,Takeshita Kazutaka⁴,Yamaguchi Yoshiji⁴,Momose Yashima⁴,Suganuma Katsuaki¹^ORCID

Affiliation:

1. The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Ibaraki, Japan

2. Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), Incheon, South Korea

3. Jiangsu Key Lab of Advanced Food Manufacturing Equipment and Technology, School of Mechanical Engineering, Jiangnan University, Wuxi, China

4. Yamato Scientific Company Ltd., Tokyo, Japan

Funder

New Energy and Industrial Technology Development Organization

JSPS KAKENHI

JST

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/63/10599943/10547343.pdf?arnumber=10547343

Reference78 articles.

1. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

2. Performance and Reliability Review of 650 V and 900 V Silicon and SiC Devices: MOSFETs, Cascode JFETs and IGBTs

3. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

4. Accurate Temperature Estimation of SiC Power mosfets Under Extreme Operating Conditions

5. High-temperature electro-ceramics and their application to SiC power modules