Thermodynamic Simulation Analysis of TSV under Temperature Cycle
Author:
Affiliation:
1. Guilin University of Aerospace Technology,Guilin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9777290/9777291/09777546.pdf?arnumber=9777546
Reference7 articles.
1. Influence of electric field, temperature, humidity, elastomer material, and encapsulation on the lifetime of dielectric elastomer actuators (DEAs) under DC actuation
2. Effects of anisotropy on the reliability of TSV microstructure
3. Electrical–Thermal Cosimulation of Coaxial TSVs With Temperature-Dependent MOS Effect Using Equivalent Circuit Models
4. A Novel Lining Method for Eliminating Plastic Deformation and Protrusion of Copper in Cu-TSV Using FEM Analysis
5. Thermal-Stress Analysis of 3D-IC Based on Artificial Neural Network
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1. Parasitic effect analysis on TSV design factors;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
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