Au–Au Surface-Activated Bonding and Its Application to Optical Microsensors With 3-D Structure
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx5/2944/5280451/05130228.pdf?arnumber=5130228
Reference15 articles.
1. Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array
2. Surface activated bonding for new flip chip and bumpless interconnect systems
3. One-step 3D shaping using a gray-tone mask for optical and microelectronic applications
4. Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films
5. Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air
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