A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure
Author:
Affiliation:
1. Shanghai University,SMIT Center, School of Mechatronics Engineering and Automation,Shanghai,China
2. Shanghai University,School of Microelectronics,Shanghai,China
3. SHT Smart High-Tech AB,Gothenburg,Sweden
Funder
National Natural Science Foundation of China
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873318.pdf?arnumber=9873318
Reference10 articles.
1. Thermal contact resistance between high-Tc superconductor and copper
2. Large‐Area Freestanding Graphene Paper for Superior Thermal Management
3. Green Reduction of Graphene Oxide Using Phytochemicals Extracted from Pomelo Grandis and Tamarindus Indica and Its Supercapacitor Applications;panicker;Journal of Materials Science Materials in Electronics,2021
4. Silver nanosintering: a lead-free alternative to soldering
5. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation of microstructural evolution and bonding mechanism in sintering of nano-Ag paste on (111)-oriented nanotwinned Cu film;Applied Surface Science;2025-11
2. Strategy for achieving high sintering and mechanical response performance of nano-Cu/two-dimensional material composite via nanoscale surface-defect-induced longitudinal diffusion;Applied Surface Science;2025-05
3. Toward Sustainable Redox‐Flow Batteries: The Role of Aqueous Organic Polymeric Electrolytes;The Chemical Record;2025-04-04
4. Sintering dynamic evolution and enhancement mechanism of nano-Cu/boron nitride composite matrix with excellent mechanical properties from the atomic perspective;Composite Structures;2025-01
5. Preparation and characterization of submicron silver particles with the nanoscale surface structure for high-reliability packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.7亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2025 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3