Structure and Properties of SnBi/Cu Composite Lead-free Solder-Reference-Cited by-同舟云学术

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Structure and Properties of SnBi/Cu Composite Lead-free Solder

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhou Jiacheng¹,Zhang Fuwen²,Wang Zhigang²,Li Zhigang²,Zhao Zhaohui²,Xu Lei²,Li Ailiang³,He Huijun⁴,Hu Qiang⁴

Affiliation:

1. Beijing Compo Advanced Technology Co., Ltd. General Research Institute for Nonferrous Metals,Industrial Research Institute for Metal Powder Material, Grinm Group.,Beijing,China

2. Gripm Advanced Materials Co., Ltd.,Beijing Compo Advanced Technology Co., Ltd.,Beijing,China

3. Zhongshan Hanhua Tin Industry Co., Ltd.,Zhongshan,China

4. Grinm Group. Gripm Advanced Materials Co., Ltd.,Industrial Research Institute for Metal Powder Material,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872672.pdf?arnumber=9872672

Reference17 articles.

1. Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

2. Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

3. Low temperature lead-free solder and its developing tendency[J];xu;Electronics Process Technology,2009

4. Research progress on Sn-Bi-Based low-temperature Pb-free solder alloys[J];wang;Material Reports,1999

5. Bi segregation at interface of the eutectic SnBi/Cu solder joint[J];liu;Acta Metallurgica Sinica,2005

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