Effect of Initial Grain Size on Growth Behavior of Intermetallic Compounds on (001)Cu During Aging
Author:
Affiliation:
1. Dalian University of Technology,School of Materials Science,Dalian,China
2. Dalian University of Technology,School of Microelectronics,Dalian,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873225.pdf?arnumber=9873225
Reference8 articles.
1. Epitaxial Cu–Sn bulk crystals grown by electric current
2. Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu
3. Interfacial transfer and phase evolution between Cu and Sn solder doped with minor Cu, Ag and Ni: experimental and theoretical investigations
4. Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
5. Comparative study of interfacial reactions of high-Sn lead-free solders on single crystal Cu and on polycrystalline Cu, 2009 Int. Conf. Electron;cui;Packag Technol High Density Packag ICEPT-HDP,2009
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