Evaluation of Residual Stress in MEMS Micromirror Die Surface Mounting Process and Shock Destructive Reliability Test

Author:

Fang Xiao-Yong1,Liu Chun-Cheng1,Li Xiu-Yuan1,Wu Jia-Hao2,Hu Kai-Ming1ORCID,Zhang Wen-Ming1ORCID

Affiliation:

1. State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China

2. Huawei Technologies Company Ltd., Shenzhen, China

Funder

National Science Foundation for Major Program

National Key Research and Development Program of China

State Key Laboratory of Mechanical System and Vibration

Double First-Class Construction Project of Shanghai Jiao Tong University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Design and investigation of dual-axis electrostatic driving MEMS scanning micromirror;International Journal of Optomechatronics;2024-05-22

2. Finite element simulation and experiment of residual stress evolution in MEMS structures;Journal of Physics: Conference Series;2024-04-01

3. Research and Optimization of Large Aperture Electromagnetic Mems Mircomirror for Automotive Lidar;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21

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