Evaluation of Residual Stress in MEMS Micromirror Die Surface Mounting Process and Shock Destructive Reliability Test
Author:
Affiliation:
1. State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China
2. Huawei Technologies Company Ltd., Shenzhen, China
Funder
National Science Foundation for Major Program
National Key Research and Development Program of China
State Key Laboratory of Mechanical System and Vibration
Double First-Class Construction Project of Shanghai Jiao Tong University
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/7361/10183770/10149193.pdf?arnumber=10149193
Reference36 articles.
1. A Low-Voltage, Low-Current, Digital-Driven MEMS Mirror for Low-Power LiDAR
2. Shock Destructive Reliability Analysis of Electromagnetic MEMS Micromirror for Automotive LiDAR
3. Low Power Electromagnetic Scanning Micromirror for LiDAR System
4. Destructive Reliability Analysis of Electromagnetic MEMS Micromirror Under Vibration Environment
5. Design and Characterization of a CMOS Electromagnetic Scanning Mirror for LiDAR Applications
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2. Finite element simulation and experiment of residual stress evolution in MEMS structures;Journal of Physics: Conference Series;2024-04-01
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