Challenges in 3D memory manufacturing and process integration-Reference-Cited by-同舟云学术

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Challenges in 3D memory manufacturing and process integration

Published:2013-12 Issue: Volume: Page:13.1.1-13.1.5
ISSN:
Container-title:2013 IEEE International Electron Devices Meeting
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Author:

Chandrasekaran Naga

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6709840/6724533/06724621.pdf?arnumber=6724621

Reference5 articles.

1. Characterization and metrology challenges for emerging memory technology landscape;chandrasekaran;Frontiers of Characterization and Metrology for Nanoelectronics NIST,2013

2. An Update on Emerging Memory: Progress to 2Xnm

3. 3D and 2.5D challenges;fleeman;GSA/Sematech Memory Conference,2012

4. Preparation on 3D interconnects;beyersdorfer;EFUG Meeting,2011

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