Fabrication and Thermal Analysis of Wafer-Level Light-Emitting Diode Packages-Reference-Cited by-同舟云学术

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Fabrication and Thermal Analysis of Wafer-Level Light-Emitting Diode Packages

Published:2008-10 Issue:10 Volume:29 Page:1118-1120
ISSN:0741-3106
Container-title:IEEE Electron Device Letters
language:
Short-container-title:IEEE Electron Device Lett.

Author:

Kang Jeung-Mo,Choi Jeong-Hyeon,Kim Du-Hyun,Kim Jae-Wook,Song Yong-Seon,Kim Geun-Ho,Han Sang-Kook

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/55/4631439/04631446.pdf?arnumber=4631446

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