Thermally enhanced plastic packages using diamond for microwave applications
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx3/3773/11020/00508499.pdf?arnumber=508499
Reference2 articles.
1. Applications of Fracture Mechanics in Electronic Packaging and Materials;kolawa;ASME EEP,1995
2. Applications of Fracture Mechanics in Electronic Packaging and Materials;hu;ASME EEP,1995
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