Modelling the Temperature Field of Electronic Devices with the Use of Infrared Thermography
Author:
Affiliation:
1. University of Ruse "Angel Kanchev",Department of Electronics
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10108076/10108087/10108375.pdf?arnumber=10108375
Reference13 articles.
1. Thermal and Electric Parameter Analysis of DC–DC Module Based on Resonant Switched Capacitor Converter
2. 3D Thermal Modelling and Verification of Power Electronic Modules
3. Heat transfer modeling for soldering processes of SMD's to printed circuit boards using low inert infrared heaters
4. Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization
5. Modeling the Parameters of a Cascaded Peltier Module using Neural Network
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3. Математичні моделі визначення температурних полів у елементах цифрових пристроїв з локальним зовнішнім нагріванням та із урахуванням термочутливості;Scientific Bulletin of UNFU;2023-10-26
4. Experimental Study of the Temperature Field of an Electronic Module;2023 18th Conference on Electrical Machines, Drives and Power Systems (ELMA);2023-06-29
5. Mathematical models for the determination of temperature fields in thermoactive elements of digital devices with local internal heating and taking thermosensitivity into account;Ukrainian Journal of Information Technology;2023
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