Performance improvements of air-cooled thermal tool with advanced technologies-Reference-Cited by-同舟云学术

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Performance improvements of air-cooled thermal tool with advanced technologies

Published:2012-03 Issue: Volume: Page:
ISSN:
Container-title:2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
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Author:

Mohammed Rahima K.,Xia Yi,Sahan Ridvan A.,Pang Ying-Feng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6182937/6188805/06188873.pdf?arnumber=6188873

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations;Thermal Science and Engineering Progress;2023-01

2. The immersion cooling technology: Current and future development in energy saving;Alexandria Engineering Journal;2022-12

3. Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids;Journal of Electronic Packaging;2022-10-22

4. Subcooled boiling in a liquid chamber for high heat flux cooling;2022 International Conference on Electronics Packaging (ICEP);2022-05-11

5. A new technology for CPU chip cooling by concentrated suspension flow of non-colloidal particles;Applied Thermal Engineering;2019-01

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