Application-specific optoelectronic packaging

Author:

Velsher B.

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Sensors, data storage and communication technologies;Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle;2017

2. Local liquid sample heating: integration and isolation of a micro-heater;Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015;2015-09-11

3. Software detection of characteristics data of optical signals received in multiparametric capillary sensors of diesel fuel;Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2015;2015-09-11

4. Review of Packaging of Optoelectronic, Photonic, and MEMS Components;IEEE Journal of Selected Topics in Quantum Electronics;2011-05

5. Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging;IEEE Transactions on Advanced Packaging;2008-05

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