3.2 Megapixel 3D-Stacked Charge Focusing SPAD for Low-Light Imaging and Depth Sensing-Reference-Cited by-同舟云学术

3.2 Megapixel 3D-Stacked Charge Focusing SPAD for Low-Light Imaging and Depth Sensing

Published:2021-12-11 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Electron Devices Meeting (IEDM)
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Author:

Morimoto K.¹,Iwata J.¹,Shinohara M.¹,Sekine H.¹,Abdelghafar A.¹,Tsuchiya H.¹,Kuroda Y.¹,Tojima K.¹,Endo W.¹,Maehashi Y.¹,Ota Y.¹,Sasago T.¹,Maekawa S.¹,Hikosaka S.¹,Kanou T.¹,Kato A.¹,Tezuka T.¹,Yoshizaki S.¹,Ogawa T.¹,Uehira K.¹,Ehara A.¹,Inui F.¹,Matsuno Y.¹,Sakurai K.¹,Ichikawa T.¹

Affiliation:

1. Canon Inc.,Kawasaki,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720605.pdf?arnumber=9720605

Reference8 articles.

1. Backside illuminated SPAD image sensor with 7.83µm pitch in 3D-stacked CMOS technology;al abbas;IEEE Int Electron Devices Meeting,0

2. Megapixel time-gated SPAD image sensor for 2D and 3D imaging applications

3. A Back Illuminated 10µm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm;ito;IEEE Int Electron Devices Meeting,0

4. A Reconfigurable 3-D-Stacked SPAD Imager With In-Pixel Histogramming for Flash LIDAR or High-Speed Time-of-Flight Imaging

5. Recent Enhancements to Interline and Electron Multiplying CCD Image Sensors

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