The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis
-
Published:2023-06
Issue:
Volume:
Page:
-
ISSN:2156-3950
-
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
-
language:
-
Short-container-title:
您需要登录后可以查看相关数据！