Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification-Reference-Cited by-同舟云学术

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Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification

Published:2024-07 Issue:7 Volume:14 Page:1200-1206
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Noh Taejoon¹,Jeong Haksan¹^ORCID,Jung Seung-Boo¹^ORCID

Affiliation:

1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea

Funder

National Research Foundation of Korea

Ministry of Science and ICT (MSIT), Korea Government

Research and Development Program of KEIT/MOTIE

Korea Government

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/5503870/10638331/10550003.pdf?arnumber=10550003

Reference34 articles.

1. Advanced Package Technologies for High-Performance Systems

2. A novel inter-package connection for advanced package-on-package enabling

3. Recent Advances and Trends in Advanced Packaging

4. Designing advanced 0D-2D hierarchical structure for Epoxy resin to accomplish exceeding thermal management and safety

5. A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

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