Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter-Reference-Cited by-同舟云学术

Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar Panel Characterization Using Infinite Focus Microscope (IFM) and Micro-Ohmmeter

Published:2024-06 Issue:6 Volume:14 Page:1123-1133
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hamid Sabarina Abdul¹,Zulkifli Muhammad Nubli¹^ORCID,Jalar Azman²^ORCID,Jusoh Wan Nursheila Wan³,Bakar Maria Abu²^ORCID,Basher Hassan⁴^ORCID,Daenen Michael⁵^ORCID

Affiliation:

1. Renewable Energy Research Laboratory (RENERAL), Electrical Engineering Section, Universiti Kuala Lumpur British Malaysian Institute, Selangor, Malaysia

2. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia (UKM), Selangor, Malaysia

3. Fire Safety Research Cluster, Aerospace Section, Malaysian Institute of Aviation Technology, Universiti Kuala Lumpur, Selangor, Malaysia

4. Solar Technics, Energy Trans and Transversal Integrated Solutions, Roeselare, Belgium

5. Faculty of Engineering Technology, Hasselt University, Hasselt, Belgium

Funder

Ministry of Higher Education of Malaysia through the Fundamental Research Grant Scheme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10575934/10509541.pdf?arnumber=10509541

Reference32 articles.

1. Effect of ultrasonic welding parameters on microstructure and mechanical properties of dissimilar joints

2. Bondability of ultrasonic Aluminum bonds on the molybdenum (de)selenide and molybdenum of back contact layer of copper indium gallium (de)selenide CIGS thin film photovoltaic solar panel

3. Microanalysis of laser micro-welded interconnections in CIGS PV modules

4. A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly

5. Innovative Cell Interconnection Based on Ribbon Bonding of Busbar-less Cells Using Silicone-based Electrically Conductive Adhesives