Microcracks in Silicon Wafers I: Inline Detection and Implications of Crack Morphology on Wafer Strength-Reference-Cited by-同舟云学术

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Microcracks in Silicon Wafers I: Inline Detection and Implications of Crack Morphology on Wafer Strength

Published:2016-01 Issue:1 Volume:6 Page:126-135
ISSN:2156-3381
Container-title:IEEE Journal of Photovoltaics
language:
Short-container-title:IEEE J. Photovoltaics

Author:

Demant Matthias¹,Welschehold Tim²,Oswald Marcus³,Bartsch Sebastian⁴,Brox Thomas²,Schoenfelder Stephan⁵,Rein Stefan¹

Affiliation:

1. Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

2. Department of Computer Science, Albert Ludwig University of Freiburg, Freiburg, Germany

3. Fraunhofer Center für Silizium-Photovoltaik, Halle, Germany

4. Jonas & Redmann, Berlin, Germany

5. Leipzig University of Applied Science, Leipzig, Germany

Funder

German Federal Ministry of Education and Research

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503869/7360842/07339415.pdf?arnumber=7339415

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