Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections
Author:
Affiliation:
1. University of Sherbrooke,Bromont,QC,Canada
2. IBM Canada Ltd,Bromont,QC,Canada
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816446.pdf?arnumber=9816446
Reference10 articles.
1. Improving the Performance of Quasi-Hemispherical CdZnTe Detectors Using Infrared Stimulation
2. Characterisation of Redlen high-flux CdZnTe
3. Effects of shrinkage on conductivity of isotropic conductive adhesives
4. Pre-Cure Modification of Electrically Conductive Adhesive for Low Temperature Interconnection
5. Process Development And Reliability Evaluation Of Electrically Conductive Adhesives (ECA) For Low Temperature Smt Assembly;lee;33rd International Electronics Manufacturing Technology Conference,2008
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