An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging-Reference-Cited by-同舟云学术

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An 11.6aF/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging

Published:2023-02 Issue:2 Volume:70 Page:391-395
ISSN:1549-7747
Container-title:IEEE Transactions on Circuits and Systems II: Express Briefs
language:
Short-container-title:IEEE Trans. Circuits Syst. II

Author:

Xiao Lanxiang¹,Chen Lei²,An Fengwei³^ORCID

Affiliation:

1. School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, China

2. School of Microelectronics, Southern University of Science and Technology, Shenzhen, China

3. School of Microelectronics and the Engineering Research Center of Integrated Circuits for Next-Generation Communications, Ministry of Education, Southern University of Science and Technology, Shenzhen, China

Funder

Shenzhen Science and Technology Innovation Commission

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/8920/10032206/09778190.pdf?arnumber=9778190

Reference24 articles.

1. Development Trends and Perspectives of Future Sensors and MEMS/NEMS

2. On the finite integral transform method for exact bending solutions of fully clamped orthotropic rectangular thin plates;rui;Appl Math Lett,2009

3. A Low-Power Wireless Piezoelectric Sensor-Based Respiration Monitoring System Realized in CMOS Process

4. Simulation of gymnastics performance based on MEMS sensor

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