Enhancing Temperature Immunity of Digital Circuit Against Aging : The Standard Cell Subset Method
Author:
Affiliation:
1. Sun Yat-sen University,School of Microelectronics Science and Technology,Guangzhou,China,510275
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10395907/10395930/10396237.pdf?arnumber=10396237
Reference16 articles.
1. Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors under Heat Sink Cooling
2. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
3. Thermal management of 3D chip with non-uniform hotspots by integrated gradient distribution annular-cavity micro-pin fins
4. Thermal Management of Electrified Vehicles—A Review
5. Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC
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