High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)-Reference-Cited by-同舟云学术

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Published:2011-02 Issue:2 Volume:1 Page:181-195
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Joohee Kim ,Jun So Pak ,Jonghyun Cho ,Eakhwan Song ,Jeonghyeon Cho ,Heegon Kim ,Taigon Song ,Junho Lee ,Hyungdong Lee ,Kunwoo Park ,Seungtaek Yang ,Min-Suk Suh ,Kwang-Yoo Byun ,Joungho Kim

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/5739011/05739019.pdf?arnumber=5739019

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