Through-Silicon Hole Interposers for 3-D IC Integration-Reference-Cited by-同舟云学术

Through-Silicon Hole Interposers for 3-D IC Integration

Published:2014-09 Issue:9 Volume:4 Page:1407-1419
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lau John H.,Ching-Kuan Lee ,Chau-Jie Zhan ,Sheng-Tsai Wu ,Yu-Lin Chao ,Ming-Ji Dai ,Ra-Min Tain ,Heng-Chieh Chien ,Jui-Feng Hung ,Chun-Hsien Chien ,Ren-Shing Cheng ,Yu-Wei Huang ,Yu-Mei Cheng ,Li-Ling Liao ,Wei-Chung Lo ,Ming-Jer Kao

Funder

Ministry of Economic Affairs, Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/6889140/06877650.pdf?arnumber=6877650

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