iTEM: a temperature-dependent electromigration reliability diagnosis tool-Reference-Cited by-同舟云学术

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iTEM: a temperature-dependent electromigration reliability diagnosis tool

Published:1997 Issue:8 Volume:16 Page:882-893
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Chin-Chi Teng ,Yi-Kan Cheng ,Rosenbaum E.,Sung-Mo Kang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx3/43/14069/00644613.pdf?arnumber=644613

Cited by 55 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. In-situ Determination of Specimen Temperature during Electromigration Testing of Solder Joint;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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