Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding
Author:
Affiliation:
1. Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10460767/10460768/10460770.pdf?arnumber=10460770
Reference24 articles.
1. High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging
2. Extremely high temperature and high pressure (x-HTHP) endurable SOI device & sensor packaging for deep sea, oil and gas applications
3. Packaging Technology for Electronic Applications in Harsh High-Temperature Environments
4. Packaging technologies for high temperature electronics and sensors;Chen
5. Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer
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