Predicting the Material Removal Rate in Chemical Mechanical Planarization Based on Improved Neural Network
-
Published:2024
Issue:
Volume:12
Page:6329-6338
-
ISSN:2169-3536
-
Container-title:IEEE Access
-
language:
-
Short-container-title:IEEE Access
Author:
Wang Jianchao1,
Shi Zhaoyang1ORCID,
Yu Pingping1,
Wang Zhenzhou1
Affiliation:
1. School of Electronic Information Engineering, Hebei University of Science and Technology, Shijiazhuang, China
Funder
Natural Science Research Project of Education Department of Hebei Province
Colleges and Universities in Hebei Province Science and Technology Research Project
University-Level Project on Chemical Mechanical Planarization Process Based on Virtual Prototype
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering