Comparative study of interfacial reactions of High-Sn lead-free solders on single crystal Cu and on polycrystalline Cu-Reference-Cited by-同舟云学术

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Comparative study of interfacial reactions of High-Sn lead-free solders on single crystal Cu and on polycrystalline Cu

Published:2009-08 Issue: Volume: Page:
ISSN:
Container-title:2009 International Conference on Electronic Packaging Technology & High Density Packaging
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Author:

Cui Yipeng,Huang Mingliang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5234372/5270539/05270679.pdf?arnumber=5270679

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of solder composition on the growth behavior of interfacial compounds on (001) Cu and polycrystalline Cu during aging;Materials Characterization;2022-12

2. Effect of reflow temperature and time on the interfacial reaction of Sn-xCu/(001) Cu;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Mechanism on the nucleation of orientation-preferred Cu6Sn5 at different temperatures and solder compositions;Journal of Alloys and Compounds;2022-03

4. Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints;Materials Letters;2012-11

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