1. Under the condition of random vibration morphological structure parameters influence on PBGA lead-free solder joint stress and strain analysis;liang;Journal of Mechanical Strength,2010
2. Fatigue life estimation of FBGA memory device under vibration
3. High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height
4. Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics
5. SnAgCu/Cu solder joints under thermal cycling condition intermetallic compound growth and behavior of solder joint failure;xiao;Journal of Materials Engineering,2010