The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections
Author:
Affiliation:
1. Saarland University,Chair of Microintegration and Reliability,Dept. Systems Engineering,Saarbruecken,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10603446/10603455/10603886.pdf?arnumber=10603886
Reference13 articles.
1. Board Flex Test,2000
2. Monotonic Bend Characterization of Board-Level Interconnects;IPC, Bannockburn, Illinois,2004
3. Flex Cracking of Multilayer Ceramic Capacitors Assembled With Pb-Free and Tin–Lead Solders
4. Advanced characterization of mechanical properties of multilayer ceramic capacitors
5. Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor
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