On the Operation of a Press Pack IGBT Module Under Short Circuit Conditions-Reference-Cited by-同舟云学术

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On the Operation of a Press Pack IGBT Module Under Short Circuit Conditions

Published:2006-08 Issue:3 Volume:29 Page:433-440
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Gunturi S.,Schneider D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/34915/01667861.pdf?arnumber=1667861

Cited by 51 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules;IEEE Transactions on Power Electronics;2024-02

2. The influence of external conditions on the physical characteristics of Press-Pack IGBTs;Journal of Physics: Conference Series;2024-02-01

3. Optimal Busbar Design for the Press-Packed IGBT-Based Modular Multilevel Converter Submodule Considering Both Normal and Fault Ride-Through Conditions;IEEE Canadian Journal of Electrical and Computer Engineering;2024

4. A Novel Series-Type Hybrid Circuit Breaker With Simple Start-Up Operation and Low Device Cost for Low-Voltage DC Distribution Networks;IEEE Transactions on Power Electronics;2023-11

5. Overview and Prospect of the Aging Mechanism of Press-pack IGBTs;2023 IEEE International Conference on Energy Internet (ICEI);2023-10-20

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