Effect of TiO<sub>2</sub> Nanoparticles Addition on the Electrochemical Migration of Low-Silver Lead-Free SAC Alloys-Reference-Cited by-同舟云学术

Effect of TiO₂ Nanoparticles Addition on the Electrochemical Migration of Low-Silver Lead-Free SAC Alloys

Published:2023-05-10 Issue: Volume: Page:
ISSN:
Container-title:2023 46th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Gharaibeh Ali¹,Rigler Dániel¹,Medgyes Bálint¹

Affiliation:

1. Budapest University of Technology and Informatics, Budapest, Műegyetem rkp. 3., Hungary,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology,Budapest,Hungary,H-1111

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168444.pdf?arnumber=10168444

Reference35 articles.

1. Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0Ag–0.5Cu solder doping with In and Zn in NaCl solution

2. Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water

3. Electrochemical Migration and Rapid Whisker Growth of Zn and Bi Dopings in Sn-3.0Ag-0.5Cu Solder in 3wt.% NaCl Solution

4. Electrochemical migration behavior of Sn-based lead-free solder

5. Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

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