One-step assembly of bimetal-phenolic networks for antifouling and antibacterial coatings

Author:

Huang Chuangxin12ORCID,Meng Lingwei12,Fu Shangwan12,Liu Xin12,Qu Hongyi23ORCID,Wang Qiuliang123

Affiliation:

1. School of Rare Earth, University of Science and Technology of China, Hefei 230026, P. R. China

2. Ganjiang Innovation Academy, Chinese Academy of Sciences, Ganzhou 341119, P. R. China

3. Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, P. R. China

Abstract

Titanium (Ti) and its alloys have been widely used as clinical implant biomaterials. However, protein adhesion and bacterial infection can negatively impact the efficacy of these implants. To combat this, a promising strategy is to develop a versatile coating on Ti materials that endows them with antifouling and antibacterial capabilities. This work focused on the development of a polydopamine (PDA) and poly(sulfobetaine methacrylate) (PSBMA) co-deposition coating on Ti substrates. The coating contained copper ions, iron ions, and catechol groups, which coordinated to assemble bimetal-phenolic networks (bMPNs). Digital imaging, SEM, AFM, XPS, water contact angle, and film thickness tests confirmed the success of the modification. The antibacterial properties of the coating were evaluated using Gram-positive Staphylococcus aureus, while the cytotoxicity of the coating on human umbilical vein endothelial cells was also examined. The results demonstrated an excellent improvement in hydrophilicity, antibacterial properties, and benign biocompatibility of the coated Ti substrate, making it suitable for bioimplants and medical devices.

Funder

Institute of Electrical Engineering, Chinese Academy of Sciences

Publisher

World Scientific Pub Co Pte Ltd

Subject

General Materials Science

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