Affiliation:
1. Department of Materials Design and Innovation, University at Buffalo, Buffalo, New York 14260, USA
Abstract
Atom Probe Tomography (APT) has emerged as a stand-alone technique for material characterization at the sub-nanometer level, with unrivaled spatial resolution, coupled with three-dimensional atomic mapping, and equal sensitivity of all elements. Over the past decade, APT has proven to be a valuable tool in advancing the understanding and design of GaN-based semiconductor technology, by revealing correlations between atomic-level structure chemistry and device performance. The uniqueness of APT is exemplified by its ability to directly analyze nanoscale features within a commercial device. In this review, the quantitative requirements for advancement in GaN-based device metrology are defined as accurate measurement of composition, structural inhomogeneities, elemental incorporation within thin interlayers, and quantification of dopants and impurities. These are bolstered by a review of recent advances in GaN-based devices, realized through APT. The rich compositional and spatial data provided by APT is necessary for the continued advancement of III-V semiconductor technology.
Publisher
World Scientific Pub Co Pte Lt
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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