Affiliation:
1. University of Colorado at Boulder
2. University of Colorado Denver
Abstract
A comprehensive comparison of 3C-SiC and 4H-SiC power MOSFETs was performed, aimed at quantifying and comparing the devices’ on-resistance and switching loss. To this end, the relevant material parameters were collected using experimental data where available, or those obtained by simulation. This includes the bulk mobility as a function of doping density, the breakdown field as a function of doping and the MOSFET channel mobility. A device model was constructed and then used to calculate the on-resistance and breakdown voltage of a properly scaled device as a function of the doping density of the blocking layer. A SPICE model was constructed to explore the switching transients and switching losses. The simulations indicate that, for the chosen material parameters, a 600 V 3C-SiC MOSFET has an on-resistance, which is less than half that of a 4H-SiC MOSFET as are the switching losses in the device.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. R.S. Muller and T.I. Kamins, Device Electronics for Integrated Circuits, third ed., John Wiley & Sons, New York, 2003 p.31.
2. W. J. Schaffer et. al, MRS Proc. No. 339, Mat. Research Soc., Pittsburgh, PA, (1994) 595-600.
3. H. Iwata, K. M. Itoh, Journal of Applied Physics 89 (2001) 11.
4. W. E. Nelson, F. A. Halden, and A. Rosengreen, Journal of Applied Physics 37 (1966) 333.
5. M. Yamanaka, et. al, J. Appl., Phys. 61 (1987) 599-603.
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