Morphology of Copper Coatings Electroplated in an Ultrasonic Field
Author:
Affiliation:
1. Universidade do Porto
2. University of Aveiro
3. University of Coimbra
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.scientific.net/MSF.455-456.844.pdf
Reference8 articles.
1. Frederick A. Lowenheim: Modern electroplating, 3th Ed., (John Wiley & Sons 1974).
2. S.A. Perusich and R.C. Alkire: Journal of Electrochem. Soc. Vol. 138 (1991), p.700.
3. F.J. Touyeras, Y. Hihn, M.L. Doche and X. Roizard: Ultrasonics Sonochemistry Vol. 8 (2001), p.285.
4. J.P. Lorimer, B. Pollet, S.S. Phull, T.J. Mason, D.J. Walton and U. Geissler: Electrochim. Acta Vol. 41 (1996), p.2737.
5. Y.Y. Zhao, C.G. Bao, R. Feng and Z.H. Chen: Ultrasonics Sonochemistry Vol. 2 (1995), p.99.
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