Material Consideration on Ta, Mo, Ru, and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects-Reference-Cited by-同舟云学术

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Material Consideration on Ta, Mo, Ru, and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects

Published:2006-04-07 Issue:4A Volume:45 Page:2497-2501
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Kim Hoon,Naito Yasushi,Koseki Toshihiko,Ohba Takayuki,Ohta Tomohiro,Kojima Yasuhiko,Sato Hiroshi,Shimogaki Yukihiro

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

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