Emerging Technologies for Advanced 3D Package Characterization to Enable the More-Than-Moore Era

Abstract

The line between packaging and silicon interconnect technology is blurring due to a reduction in package interconnect dimensions, which drives an increase in image resolution requirements. It is becoming more difficult to localize and image defects and structures throughout the packaging life cycle, from materials selection, through package and silicon design co-optimization, development, production, and field failure diagnostics. Characterization and failure analysis (FA) solutions must provide fast results for rapid development of packages meeting the required electrical, mechanical and reliability specifications with high yield and quality. Heterogeneous integration and complex packages containing multiple die drive new approaches to rapidly characterize structures, defects and processes. This paper presents new artificial intelligence (AI) developments in 3D X-ray microscopy (XRM) for non-destructive submicron-resolution imaging of packages. It also introduces the latest developments in focused ion beam (FIB) microscopes adapted with an integrated fs-laser for precise and fast analysis of deeply buried features in advanced packages.