Abstract
In this paper, we present the design of an effective pulse current deposition process for low stress, crack-free Cr coatings deposited from standard Cr3+ electrolyte commonly used by industry. Parameters for pulse current deposition process such as
t
o
n
,
t
o
f
f
,
and duty cycle are based on detailed analysis and modeling of in situ stress transients during Cr deposition and relaxation. A general procedure and criterion are derived for pulse current function design which should be of broader significance for the synthesis of functional Cr coatings. Comparative characterization of pulse and direct current deposited Cr films is presented. These data illustrate superior properties and stress-state of the Cr films deposited using our newly developed approach to pulse current function design.
Funder
National Science Foundation
American Electroplaters and Surface Finishers Foundation
Publisher
The Electrochemical Society
Subject
Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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