Characterization of metal line-width variation in via first dual-damascene approach and its modeling using machine learning artificial neural network algorithms-Reference-Cited by-同舟云学术

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Characterization of metal line-width variation in via first dual-damascene approach and its modeling using machine learning artificial neural network algorithms

Published:2018-03-20 Issue: Volume: Page:
ISSN:
Container-title:Design-Process-Technology Co-optimization for Manufacturability XII
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Author:

Cantu Pietro,Catarisano Chiara,Corneo Nicoletta,Litterio Emma,Triulzi Benedetta,Patelmo Matteo,Dundulachi Alessandro,Mantovani Valeria

Publisher

SPIE

Reference14 articles.

1. Linewidth variations in photoresist patterns on profiled surfaces

2. Study of iso/dense bias of barcs and gap-fill materials on via wafers;Huang,2006

3. Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process;Bhave,2004

4. Device for the treatment of hiccups;Hung,2002

5. Cd-sem technologies for 65-nm process node;Yamaguchi,2005

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