Understanding chemical and physical mechanisms in atomic layer deposition
Author:
Affiliation:
1. Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA
Funder
U.S. Department of Energy
Intel Corporation
Publisher
AIP Publishing
Subject
Physical and Theoretical Chemistry,General Physics and Astronomy
Link
http://aip.scitation.org/doi/am-pdf/10.1063/1.5133390
Reference147 articles.
1. AVD and ALD as Two Complementary Technology Solutions for Next Generation Dielectric and Conductive Thin-Film Processing
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4. Atomic Layer Deposition of Nanostructured Materials for Energy and Environmental Applications
5. Applications of atomic layer deposition in solar cells
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