Healing processes in submicron Al interconnects after electromigration failure
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.118914
Reference6 articles.
1. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
2. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
3. In-Situ TEM Observation of Electromigration Damage by Surface or Interface Diffusion in Al and Al Alloy Films
4. In-Situ TEM Observation of Electromigration Damage by Surface or Interface Diffusion in Al and Al Alloy Films
5. In-Situ TEM Observation of Electromigration Damage by Surface or Interface Diffusion in Al and Al Alloy Films
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2. Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy;Applied Physics A;2022-06-27
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