Some aspects of bonding‐solder deterioration observed in long‐lived semiconductor lasers: Solder migration and whisker growth

Author:

Mizuishi Ken’ichi

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Cited by 53 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD);Acta Materialia;2016-01

2. Basic Diode Laser Degradation Modes;Semiconductor Laser Engineering, Reliability and Diagnostics;2013-01-24

3. Low homologous temperature (<0.2) sputtering of indium films on silicon;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2012-11

4. Interfacial Reactions in Sn-Co-(Cu)/Ni Couples With/Without Current Stressing;Journal of Electronic Materials;2012-08-29

5. Tin Whiskers;Lead-Free Solders: Materials Reliability for Electronics;2012-03-15

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