Microscopy of terahertz spoof surface plasmons propagating on planar metamaterial waveguides

Author:

Sulollari N.1ORCID,Park S. J.2ORCID,Salih M.1ORCID,Rubino P.1ORCID,Burnett A. D.1ORCID,Li L.1ORCID,Linfield E. H.1ORCID,Davies A. G.1ORCID,Cunningham J. E.1ORCID,Dean P.1ORCID

Affiliation:

1. School of Electronic and Electrical Engineering, University of Leeds 1 , LS2 9JT Leeds, United Kingdom

2. School of Electronic Engineering and Computer Science, Queen Mary University of London 2 , E1 4NS London, United Kingdom

Abstract

Surface plasmon polaritons (SPPs) are electromagnetic waves that have attracted significant interest owing to their subwavelength confinement and the strong field enhancement that they provide. Yet in the terahertz (THz) frequency region of the spectrum, which is well below the plasma frequency of metals, these surface waves are characterized by extremely weak confinement that has severely limited their exploitation for information processing and sensing. One means to circumvent this limitation is through subwavelength structuring of a metallic surface, which can thereby be engineered to support the propagation of spoof surface plasmon polaritons (SSPPs) that closely mimic the properties of SPPs. In this work, we report the design and experimental characterization of an ultra-thin metamaterial planar waveguide that supports SSPPs at THz frequencies. Finite-element method simulations are shown to predict the excitation of SSPPs on the surface of our devices under free-space illumination at 3.45 THz. We investigate these structures experimentally using THz scattering-type scanning near-field microscopy (THz-s-SNOM) to map directly the out-of-plane electric field associated with the propagation of SSPPs on the surface of the waveguides. Our work paves the way for the future development of plasmonic integrated circuit technologies and components operating in the THz frequency band.

Funder

Engineering and Physical Sciences Research Council

Royal Society

Wolfson Foundation

Publisher

AIP Publishing

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