Enhanced imaging of electronic hot spots using quantum squeezed light

Author:

An Haechan12ORCID,Najjar Amiri Ali2ORCID,Goronzy Dominic P.3ORCID,Garcia Wetten David A.3ORCID,Bedzyk Michael J.345ORCID,Shakouri Ali1,Hersam Mark C.356ORCID,Hosseini Mahdi125ORCID

Affiliation:

1. Elmore Family School of Electrical and Computer Engineering, Purdue University 1 , West Lafayette, Indiana 47907, USA

2. Department of Electrical and Computer Engineering, Northwestern University, Evanston 2 , Illinois 60208, USA

3. Department of Materials Science and Engineering, Northwestern University 3 , Evanston, Illinois 60208, USA

4. Department of Physics and Astronomy, Northwestern University 4 , Evanston, Illinois 60208, USA

5. Applied Physics Program, Northwestern University, Evanston 5 , Illinois 60208, USA

6. Department of Chemistry, Northwestern University 6 , Evanston, Illinois 60208, USA

Abstract

Detecting electronic hot spots is important for understanding the heat dissipation and thermal management of electronic and semiconductor devices. Optical thermoreflective imaging is being used to perform precise temporal and spatial imaging of heat on wires and semiconductor materials. We apply quantum squeezed light to perform thermoreflective imaging on micro-wires, surpassing the shot-noise limit of classical approaches. We obtain a far-field temperature sensing accuracy of 42 mK after 50 ms of averaging and show that a 256×256 pixel image can be constructed with such sensitivity in 10 min. We can further obtain single-shot temperature sensing of 1.6 K after only 10 μs of averaging, enabling a dynamical study of heat dissipation. Not only do the quantum images provide accurate spatiotemporal information about heat distribution but also the measure of quantum correlation provides additional information, inaccessible by classical techniques, which can lead to a better understanding of the dynamics. We apply the technique to both aluminum and niobium microwires and discuss the applications of the technique in studying electron dynamics at low temperatures.

Funder

National Science Foundation

U.S. Department of Defense

U.S. Department of Energy

Publisher

AIP Publishing

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