Silicon‐to‐silicon direct bonding method
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.337750
Reference2 articles.
1. Wafer bonding for silicon‐on‐insulator technologies
2. The Evolution of the Theory for the Voltage-Current Characteristic of P-N Junctions
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