High spatial resolution subsurface thermal emission microscopy-Reference-Cited by-同舟云学术

High spatial resolution subsurface thermal emission microscopy

Published:2004-05-31 Issue:22 Volume:84 Page:4529-4531
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:

Author:

Ippolito S. B.¹,Thorne S. A.¹,Eraslan M. G.¹,Goldberg B. B.¹,Ünlü M. S.¹,Leblebici Y.²

Affiliation:

1. Department of Physics and Electrical and Computer Engineering and the Photonics Center, Boston University, 8 Saint Mary’s Street, Boston, Massachusetts 02215

2. Microelectronic Systems Laboratory, Swiss Federal Institute of Technology, CH-1015 Lausanne, Switzerland

Abstract

We apply the numerical aperture increasing lens technique to subsurface thermal emission microscopy of Si integrated circuits. We achieve improvements in the amount of light collected and the spatial resolution, well beyond the limits of conventional thermal emission microscopy. We experimentally demonstrate a lateral spatial resolution of 1.4 μm and a longitudinal spatial resolution of 7.4 μm, for thermal imaging at free space wavelengths up to 5 μm.

Publisher

AIP Publishing

Link

https://pubs.aip.org/aip/apl/article-pdf/84/22/4529/18589348/4529_1_online.pdf

Reference13 articles.

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