Hotspot cooling with jumping-drop vapor chambers
Author:
Affiliation:
1. Department of Mechanical Engineering and Materials Science, Duke University, Durham, North Carolina 27708, USA
2. Intel Corporation, Chandler, Arizona 85226, USA
Funder
National Science Foundation (NSF)
Intel Corporation (Intel)
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4979477
Reference34 articles.
1. Cooling a Microprocessor Chip
2. Thermal Management of On-Chip Hot Spot
3. A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration
4. Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements
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