Research and Optimization Design of Thermal Management for LED

Author:

Jiang Bowen

Abstract

LED, a lighting source that has gained popularity in the 21st century, possesses characteristics such as energy efficiency, eco-friendliness, compactness, and durability. However, its electro-optical conversion efficiency remains relatively low, as approximately 80% to 90% of the input power is dissipated as thermal energy. Consequently, the temperature of the LED rises, leading to a decrease in its luminous efficiency. Hence, it is crucial to conduct research on efficient heat dissipation methods for LEDs. We have compiled research plans from various scientific institutions and observed that through optimized design, the heat dissipation capability of LEDs has significantly improved. This improvement has resulted in reduced thermal stress within the chips and packaging, ultimately enhancing their reliability.

Publisher

Darcy & Roy Press Co. Ltd.

Reference23 articles.

1. Liukui Liu. Analysis of thermal performance of high-power LED heat sink and structure optimization of cold extrusion forming die [D]. [Master's thesis]. Guangzhou: South China University of Technology, 2014.

2. Dong Yuan. LED light-thermal structure optimization design [D]. [Doctoral thesis]. Guangzhou: South China University of Technology, 2013.

3. Jiaopin Wang. Thermal design and thermal-mechanical reliability analysis of high-power LED lighting system [D]. [Master's thesis]. Guilin: Guilin University of Electronic Technology, 2011.

4. Yanyan Wu. GaN white LED failure mechanism analysis and research [D]. [Master's thesis]. Beijing: Beijing University of Technology, 2013.

5. Dongfei Hu. Power LED packaging technology and thermal design [D]. [Master's thesis]. Hangzhou: Hangzhou University of Electronic Science and Technology, 2011.

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