Size effect of resistivity due to surface roughness scattering in alternative interconnect metals: Cu, Co, Ru, and Mo
Author:
Funder
National Natural Science Foundation of China
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.107.195422/fulltext
Reference83 articles.
1. Thickness dependent electrical resistivity of ultrathin (<40 nm) Cu films
2. Alteration of Cu conductivity in the size effect regime
3. Influence of phonon, geometry, impurity, and grain size on Copper line resistivity
4. Size-Dependent Resistivity in Nanoscale Interconnects
5. Resistivity dominated by surface scattering in sub-50 nm Cu wires
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