Wetting layer of copper on the tantalum (001) surface-Reference-Cited by-同舟云学术

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Wetting layer of copper on the tantalum (001) surface

Published:2016-12-22 Issue:23 Volume:94 Page:
ISSN:2469-9950
Container-title:Physical Review B
language:en
Short-container-title:Phys. Rev. B

Author:

Dupraz Maxime,Poloni Roberta,Ratter Kitti,Rodney David,De Santis Maurizio,Gilles Bruno,Beutier Guillaume,Verdier Marc

Funder

European Synchrotron Radiation Facility

Agence Nationale de la Recherche

Publisher

American Physical Society (APS)

Reference41 articles.

1. Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

2. Failure mechanism of Ta diffusion barrier between Cu and Si

3. Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization

4. An in situ X-ray diffraction study of phase separation in Cu–Ta alloy thin films

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